Home > Technologies > Die Packaging
Die Packaging

PCL provides full die-level package solution from die-bond, wire-bond and seam seal. All components would be screened by burn-in system.

We could provide:

    1. Eutectic and Epoxy DA available
    2. DA TO56/TO38/TO46 header with Eutectic
    3. DA TO46/TO56/TO38 header with Ag paste or epoxy
    4. Rotary Bonding Head
    5. AuSn perform cutter
Copyright © 2009,PCL (Suzhou) Co., LTD