本集團提系列性的晶片封裝, 涵蓋自die-bond, wire-bond 及seam seal. 所有的元件皆經過 burn-in system 進行不良品的篩出, 確保品質. |
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Eutectic 及Epoxy Die
Attach |
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Die Attach TO56/TO38/TO46 header
with Eutectic |
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Die Attach TO46/TO56/TO38 header
with Ag paste or epoxy |
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Rotary Bonding Head
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AuSn perform
cutter |
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