本集团提系列性的芯片封装, 涵盖自die-bond, wire-bond 及seam seal. 所有的组件皆经过 burn-in system 进行不良品的筛出, 确保质量. |
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Eutectic 及Epoxy Die
Attach |
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Die Attach TO56/TO38/TO46 header
with Eutectic |
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Die Attach TO46/TO56/TO38 header
with Ag paste or epoxy |
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Rotary Bonding Head
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AuSn perform
cutter |
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